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EMCoS > Announcements > News & Events > 2015 > New Solutions Coming Soon!

New Solutions Coming Soon!


Upcoming EMC Studio v8.2 will introduce new tools and special calculation approaches for analysis of human exposure to electromagnetic fields. These features can be successfully applied for low frequency applications starting from 0+ to 10 MHz (like wireless power transfer or high voltage systems in EV/HV vehicles) as well as for higher frequencies.

  • Special calculation approaches for homogeneous and non-homogeneous body models are available
  • Reducing of near field calculation time inside homogeneous dielectric bodies by using special technique for inner volume

  • Import and visualization of human voxel-based models. Support of interactive transformation tools

  • Manipulation with voxel-based virtual skeleton (move and rotate skeleton bones considering interconnecting joints)
  • Automatic adjustment of voxel model to skeleton pose

  • Special post processing tools for human exposure analysis for both homogeneous and non-homogeneous models. Visualization of 3D distribution and 2D slices for field, current and SAR values

Multichannel Link Path Analysis (LPA) is a powerful, yet easy to use tool to investigate high-speed communication systems and link paths involving many different components, like traces, transmission lines, via transitions, connectors and other discontinuities. LPA tool will allow users to estimate link path performance, discover unwanted side effects along the path, view eye patterns and perform S-parameters quality checks.

  • Link path components come from measurements or suppliers as S/Y/Z-parameters. There is no limit to the size and number of S-parameters blocks that are allowed
  • Different types of voltage sources are supported to thoroughly investigate system response under different initial conditions (NRZ, bit sequence, piecewise, jitter, TX equalization, filters, frequency-depended impedances)

  • Various equalization options (CTLE, FFE, DFE) and support of frequency-dependent impedances allow users to fine tune the link path terminations
  • Cascading and de-embedding tools can be used to obtain an equivalent matrix from a sequence of S-parameters blocks and to extract an unknown part in a cascade of blocks

  • LPA provides a fast and easy way to evaluate S-parameters quality by checking passivity and causality properties of each block
  • Cables and interconnections can be defined as lossless/lossy transmission lines or by 2D cross-section (multicore microstrip and stripline, coaxial, twin-ax and quad cable)

  • Built-in and easily configurable T-network and Pi-network blocks can be used to include corresponding circuit components in the link path